Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Wed Jan 15 11:42:57 EST 2003 | burb1999
we have recently been trying silver composition on our pads with our PCB boards. I am wondering what if any characteristics are different from tin etc... I have found with profiling the board it to be about the same temps. but getting granular looki
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Mon Feb 22 10:01:01 EST 2010 | jtsyeung
Since the inductor is electro-magnetic, that means the device is composite of coil and ferrite metal. The inductor inside the reflow oven meets with blower motors which close to the inductor and generate magnetic field. With such conditions, Lawren
Electronics Forum | Thu Jan 14 23:38:34 EST 1999 | Chris G.
| I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some con
Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny
Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).
Electronics Forum | Tue Apr 13 19:14:25 EDT 2004 | Dreamsniper
Hi DaveF, To explain. The BGA that we have is from Motorola. The solder balls of these BGA's are Eutectic Solder and processed using a NC flux (as per info from supplier). So this means that the BGA pad and solder connections had NC flux process. W
Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter
Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
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