Electronics Forum | Tue Dec 24 13:02:26 EST 2002 | cnotebaert
Are you sure your custoemr didn't get a little confused with what he saw or was told? When he says optical comparator is he talking about the basic component recognition system? some machines when showing the component (on the CRT) show a template th
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Fri Apr 21 14:31:20 EDT 2000 | JACOB LACOURSE
I FOUND THAT ONE OF THE MANY REASONS FOR TOMBSTONING COMPONENTS IS MOISTURE IN SOLDER PASTE. ONE WAY TO CONFIRM THIS IS TO CHECK FOR EXCESIVE SOLDER BALLS AROUND THE PART IF THEY ARE PRESENT THEN YOU MAY HAVE A HUMIDITY PROBLEM. GOOD LUCK!!! JAKE
Electronics Forum | Mon Jul 16 16:42:40 EDT 2007 | pnguyvu
Hi Jacky, It seems you have solder bead problem, beading occurs when the solder paste brick splatter as a component is placed into it, after reflow, the splatter becomes a spherical solder ball. Hope this will help. Steve USA STENCILS
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz
Thank you Pavel. Aleksander
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
