Industry News | 2023-06-07 19:51:18.0
Funds would help ensure success of the CHIPS Act and Biden's "Presidential Determination" on PCBs
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2011-04-01 13:21:14.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
Industry News | 2017-07-11 21:18:58.0
The SMTA is pleased to announce Rune Jensen, Microsoft, will keynote SMTA International the morning of Tuesday, September 19 with his presentation “Experiencing Mixed Reality - using the Microsoft HoloLens.”
Industry News | 2013-02-19 18:26:34.0
In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.
Industry News | 2009-09-13 17:36:35.0
Penang, Malaysia – SMTA is proud to announce the final program for the South East Asia Technical Conference on Electronics Assembly Technologies, to be held November 18-20, 2009 at the Equatorial Hotel in Penang, Malaysia.
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
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