Electronics Forum: class%' and '8%'='3 (Page 9 of 10)

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon

| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi

| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Fri Jun 02 14:42:06 EDT 2023 | tommy_magyar

"If for example a customer requested assemblies but never specified their requirements, would MFGs be expected/required to follow parameters from a specific class related to the end use of said product?" Answer: The customer placed an order with you

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Thu Jun 01 22:05:01 EDT 2023 | calebcsmt

For contract manufacturers, Unless expectations/requirements are particularly specified by customers OR there is a discussion and contract in place, what are the expectations when it comes to the assembly standards and practices? Is J-STD essenti

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Thu Jun 01 22:47:27 EDT 2023 | spoiltforchoice

most, possibly all of our clients, don't specify this kind of thing even when they are in fields where you might expect they should and should be aware of them. However if you cherry pick a couple of class 2 requirements such as offset and joint widt

solder splatter inspection

Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef

You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu

loss of metalization on a Earth Pad on a chip component MPN-SBSGP5000102MXT

Electronics Forum | Mon Aug 24 21:16:57 EDT 2020 | smith88

I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1.

Through holes

Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef

First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu

Does anyone remember the takt time formula for the reflow oven

Electronics Forum | Thu Mar 13 08:39:53 EDT 2008 | ck_the_flip

Takt time (without a google search) is the rate (amount of time per pc.) at which stuff gets made on an assembly line, a workcell, a hi-speed SMT line, CNC machine cell, etc.... Takt time is governed by the gate (the slowest person, machine, etc. in

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