Electronics Forum: coating and stringing (Page 9 of 10)

Can lead free and non lead free production mix in the same mach

Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane

"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from

Can lead free and non lead free production mix in the same mach

Electronics Forum | Wed Apr 26 07:37:52 EDT 2006 | amol_kane

"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

Can lead free and non lead free production mix in the same mach

Electronics Forum | Wed Apr 26 01:18:33 EDT 2006 | ge_lim

Hi We are in the process of developing a lead free product to be used in a non lead free selective soldering machine, i do have concern in these, and hope you guy can share your experienced expert opinion: 1. What does it take to convert to lead fre

Possible to mix a No-Clean solder and a Clean solder process

Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm

Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

Re: HASL - again?

Electronics Forum | Fri Jun 18 14:06:15 EDT 1999 | John Thorup

| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi

Re: HASL - again?

Electronics Forum | Fri Jun 18 13:47:33 EDT 1999 | Jason Gregory

| Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave review

Re: HASL - again?

Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory

| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave

Re: HASL - again?

Electronics Forum | Fri Jun 18 17:19:48 EDT 1999 | Jason Gregory

| | | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rav


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