Industry News | 2013-06-26 14:34:43.0
Nordson ASYMTEK will be hosting live demonstrations of precision coating and jetting processes at SEMICON West 2013. Engineers will be available to discuss equipment, applications, and the manufacturing process.
Industry News | 2018-01-08 18:24:10.0
Nordson ASYMTEK announces that it has acquired the rights and assets to progressive cavity pump (PCP) product lines from Infiniti Dosing o.m.s, based in Polling, Germany. The transaction, which closed on January 5, 2018, provides Nordson ASYMTEK with dispensing and dosing products marketed by Infiniti under the Dot Streamer (DS) and Accura brands. Infiniti's owner and founder, Mr. Jean-Claude Tytgat, will join Nordson ASYMTEK and continue to work on technology developments.
Industry News | 2018-06-03 19:35:57.0
Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.
Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-08-06 20:44:43.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Industry News | 2012-03-09 17:47:15.0
IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
