Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Wed Nov 09 05:44:06 EST 2005 | grantp
Hi, It sounds like your vision is not setup right for this component, and it's rejecting some of them because they would be failing the test. This brings up a point we discovered. Don't use auto teach for the component if your using HYDRA or vision
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Wed Nov 09 11:01:41 EST 2005 | DannyJ
Hi Red and Greg, First, to Avalancher, the service that is mentioned is fantastic. I have used it various times with various connectors and headers with fantastic results. Just contact MyData and they'll tell you what they need. It's usually 5-1
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Thu Jun 02 13:32:05 EDT 2011 | davef
Melanie: We're with AVFOM. If you don't believe there is solder on the pads, use a beer can opener to pop the component off the board and you will have your answer. Easy-peasy. Who ever told you 'if there is solder, there is voids' in solder connect
Electronics Forum | Thu May 07 21:25:56 EDT 1998 | D.Lange
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
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