Electronics Forum: component weights (Page 9 of 20)

SMT packages that can solder inverted?

Electronics Forum | Thu Aug 28 16:13:06 EDT 2003 | Dan Gosselin

Thanks everyone for your help. I have since found a good article I am downloading of of the SMTA website. Dan Title : EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Author : Mulugeta Abtew Author Company

Average paste volume estimate

Electronics Forum | Tue May 20 12:41:27 EDT 2008 | slthomas

We had some materials management brainiac insist that every component of a product had to have an exact quantity stated on the BOM so we had to weigh every board with and without paste printed. We rented a 4 place digital scale, weighed 5 of each boa

QFN DROP DURING 2ND TIME REFLOW SOLDERING

Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob

You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a

Securing components for wave soldering

Electronics Forum | Wed Jul 14 14:10:11 EDT 2004 | chad

I've had several customers use bean bags. There are a couple companies that will custom make them per size and weight. Other options are wave fixtures. You can contact me offline if you need more specific information 503-924-2747

Baking components at 70 degree

Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang

Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.

Baking components at 70 degree

Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef

Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?

Weights during reflow?

Electronics Forum | Wed Oct 11 07:51:47 EDT 2017 | tsvetan

I've never seen this Can you post picture? aluminum may sink heat and shadow component if too big

Double sided SMT, bottom side first or top side first ?

Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi

Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th

intro to 2 sided assembly

Electronics Forum | Sat Dec 01 09:09:24 EST 2001 | davef

Sounds like a perfect place to start. Sure we all have different perceptions of fun, don't we? Trial by fire, eh? ;-) A prediction: Your cost accountants are going to freak when they compare the production costs for this board to the more famili

Re: Solder surface tension

Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F

| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a


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