Electronics Forum | Thu Jul 12 08:49:14 EDT 2018 | robl
Started with a 1 part shield and we had an 0201 tombstone due to the pad design. We changed the pad design but the customer wanted to be 100% sure, so we moved to a 2 part, adding the lid after verification. We also trialled the original 1 part c
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef
His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Tue Dec 01 14:44:04 EST 1998 | Terry Burnette
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Tue Feb 28 13:28:29 EST 2023 | markhoch
If you decide on an epoxy floor, make sure you use a contractor that is experienced with installing ESD epoxy floors. The epoxy needs to be continuously mixed to keep the media consistent throughout. We had a contractor who failed to do that, and wh
