Electronics Forum: copper foil reflow (Page 9 of 50)

Re: Tombstones

Electronics Forum | Thu Aug 06 12:16:52 EDT 1998 | Rin

I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

Re: Bare Copper Circuit Boards

Electronics Forum | Sun Jun 20 16:58:31 EDT 1999 | Chrys Shea

Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. Is your cubemate the same gu

LGA voiding

Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama

Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble

SMT REWORKING ( BGA )

Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve

The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic su

SMD ceramic cap size limit on metal substrate

Electronics Forum | Thu Nov 11 10:55:32 EST 1999 | KenF

Hi, could anyone tell me the maximum size of an SMD ceramic capacitor that can be assembled on a copper based substrate reliably? The SMD will be reflowed on the copper substrate. The main concern is the CTE mismatch between the ceramic capacitor and

SUPER THIN PCB BOARD

Electronics Forum | Tue Jun 20 06:47:53 EDT 2006 | Julien VITTU (STMicro)

hung copper balance is really critical in your case. in the same configuration we have specified less than 5% copper variation between top and bottom layer if you keep this rule, assembly will be ok, otherwise you will get a terrible warpage after

Re: PCB warpage

Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney

Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t

Re: Very high interconnect density

Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian

We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an

Re: Very high interconnect density

Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon

We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control


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