Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
Electronics Forum | Tue Mar 04 20:47:48 EST 2008 | davef
Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure 4.14-3, Note 10: A1 corner must be identified by chamfer, ink, mark, metalized markings, indentation or other feature of package body, lid or integra
Electronics Forum | Sat Mar 20 00:58:10 EST 1999 | Mike C
| After rmoving a BGA (plastic)to correct unexplained shorts | I installed another BGA using flux only. | Checking on an X Ray machine and found two shorts. | | can anyone give a good explenation ? | | Thanks | | Ron | Another possibility Via's n
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Fri Nov 19 13:37:10 EST 1999 | JAX
I have recently started programming Siemens equipment (Monday) and am a little confused on some issues. When inspecting BGA packages does the machine locate a corner ball and use it as an anchor to locate the rest? If not how does it know that it has
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
Electronics Forum | Wed Jun 08 10:57:20 EDT 2011 | pcbrookie
We recently got our last BGA X-Ray results back (no X-ray in house yet) and had more than one board/BGA look like the attached image. The balls on one corner are completely collapsed (so much so that bridges appear) and raised on the opposite corner
Electronics Forum | Mon Aug 25 00:31:53 EDT 2003 | Dennis O'Donnelll
It could be moisture in the BGA. You should always bake the BGA before installation of course. But most likely you are usingf too much heat or too fast of a ramp speed. Make sure your top heater temp is below 230C. Set top heater to 220C, then adj
Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey
Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
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