Electronics Forum: deforming (Page 9 of 12)

Etch strain gauge in copper layer to measure deformations during press process [How to?]

Electronics Forum | Mon May 26 04:39:49 EDT 2014 | sarason

Damn near impossible. You need to see a real change in the difference between the 2 elements you are reading. So to give yourself any hope run 2 long traces one top one bottom up the length of the board. Then compare to 2 wriggly traces at one end (o

Stencil deformation patterns

Electronics Forum | Wed May 23 15:58:01 EDT 2018 | mcurtin2011

Those patterns are either: a) the stencil has recieved some streching stress - either being pushed on and dented by some obstruction, or b) has been worn thin and therefore streched as a result. This type of change to your foil may cause a slight sh

Other Jet Printer besides MYCRONIC?

Electronics Forum | Wed Jan 23 23:45:35 EST 2019 | kiransahu

Piezoelectric type (office/industrial) In this method, a piezoelectric (piezo) element, whose volume is deformed when voltage is applied, is used to discharge ink particles. This element is attached to the component that is filled with ink. Then, th

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F

Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca

Re: Component solderability problems TO263 package

Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles

It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

glue measurement

Electronics Forum | Wed Oct 10 02:44:47 EDT 2001 | djarvis

Frank, Don't know about point 1 but if they don't fall off I don't worry about it. If they do fall off it's generally because someone has mishandled them before the wave, like shoving them into racks and the like. If they have fallen off and you can'

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette

Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p

Specification for Screw Torques

Electronics Forum | Tue Nov 06 18:39:08 EST 2001 | MikeF

Also, check the website for Assembly magazine, http://www.assemblymag.com, they have some good information on the basics of torque. Determining the "correct" torque value can become very complicated very quickly. The same size screws made from differ

Has anyone looked into Vacuum storage on moisture sensitive devi

Electronics Forum | Tue Aug 19 09:09:15 EDT 2003 | D Peter

After a few problems and time constraints on baking moisture sensitive devices, we are looking at solutions to storage rather than going after a rebaking solution. One thing that always bothered me about baking was the oxidation on the lead finish,


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