Electronics Forum | Tue Mar 01 09:20:42 EST 2005 | rlackey
I remember Metro Nozzles mentioning that they are bringing out a new "blade" nozzle soon to allow closer density placement of 0402's & 0603's than the 08MPF allows. Also noticed that you get far better placement with a 1 mil camera than a 4 mil, coz
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Wed Jun 08 10:32:27 EDT 2005 | rlackey
We ran an MVT 1820 Supra against a VT-Win-II for around 40K high density boards. One machine was 1/3 of the price of the other, more accurate in production, faster, and could handle larger boards. Guess which won? Fortunately we were able to loo
Electronics Forum | Thu Jun 09 10:08:59 EDT 2005 | Herman
Hello, We had serval times problems with wavesoldering medium and low density boards. After analysis one time the problems where in the carrier an other time the flux was Not visible contaminated, ...etc. I wonder, does any one know a complete wav
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Mon Jan 15 13:38:29 EST 2007 | realchunks
Check the temp of your pot. It may be getting cooler if you can notice a difference in pump height and density. You may have lost a heater element or two. You can adjust your pot chemestry, but why would you want to if your solder sample came back
Electronics Forum | Tue Jan 16 07:17:20 EST 2007 | adamp
I have checked pot temperature in different parts of solder pot and it looks like it is correct (250C). I have also lowered solder pot temperature and removed copper from the surface of the solder pot (operation repeated couple times). There is still
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef
8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5
Electronics Forum | Thu Aug 28 12:18:03 EDT 2008 | grics
Why yes, I regognize all the best. WML, I have an idea... I am going to call it, the Dunker. Instead of anyone foaming, I will get the wave operators to throw the boards into a rubbermaid tub full of flux/gasoline mixture and send through to the wav
