Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
Electronics Forum | Thu Mar 20 14:05:17 EST 2003 | MA/NY DDave
Hi Rene Great, I am glad to see that you are recommending by experience placement control as affected by the pick operation. Neat to see you are also noting a thinner paste deposition. YiEng, MA/NY DDave
Electronics Forum | Tue Dec 09 10:46:58 EST 2003 | Peter
Hi. Is there anyone with experience in soldering standard smd on a pvd (physical vapor deposited) titanium surface? Are there any rules to obey? Especially concering solder paste, surface treatment, reflow profile and oven etc. Thanks
Electronics Forum | Fri Feb 27 07:48:34 EST 2004 | mk
Sorry I am late with the solution but I have been out on the road. Absolutely the reason solid solder deposit was invented. Hands down the best and most affordable, dependable solution to your challenge. http://www.sipad.com mkehoe@sipad.net
Electronics Forum | Sun May 02 07:36:47 EDT 2004 | mk
Use solid solder deposit for GGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Sun May 02 07:37:28 EDT 2004 | mk
Use solid solder deposit for BGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Tue Jun 01 10:15:29 EDT 2004 | davef
We agree with John about his comments on the controlable factors relating to your printer, but we'd add that paste formulation and mesh are also contributors to nice looking bricks.
Electronics Forum | Tue Aug 03 14:39:11 EDT 2004 | russ
It is great for single sided boards, but you will have to use a glue/wave process or something else for second side assemblies. Russ
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