Electronics Forum | Sat May 09 09:12:53 EDT 2015 | sarason
Might I add, avoid Y5V if you want a reliable design and Marc is correct do look at those charts for X7R voltage dip under load, if you are doing low volume, save yourself the trouble and time, just overrate. sarason
Electronics Forum | Wed May 03 15:00:44 EDT 2006 | patrickbruneel
It all depends on process, design and environment in which the contacts are used. Both have excellent conductivity characteristics Both don't oxidize over time On the other hand gold is much softer then carbon, and after hitting that contact a gazil
Electronics Forum | Mon Apr 16 18:49:40 EDT 2012 | tris101
Hi guys, I'm looking for some tooling parts and I hope you can point me in the right direction. We design basic in house reflow Carriers to surport boards during reflow. I would like to add clamps to our designs but I can not locate any off the she
Electronics Forum | Fri Jul 10 14:23:23 EDT 1998 | Bob Willis
You can get a report and CD ROM on pin in hole reflow assembly from the SMTA main office in the USA. They also have a new report on Double Sided Reflow Design and Assembly. | Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help ear
Electronics Forum | Fri May 08 23:28:28 EDT 2015 | alphatronique
Hi dont play whit cap substitute ,you may screw up the whole design ,many ceramic decoupling cap was sensitive to applied voltage and temperature specially true for X5R and Y5V type. so a 4V cap may have right capacity at 3.3V but a 6 volt cap
Electronics Forum | Thu Nov 20 17:30:55 EST 2014 | gregcr
Hi All, I have a customer with a very dense design (24 layers, 0201's lots of micro-BGA and lead-less), and they run extreme data rates. Every once and a while they will have a unit that has some speed fall off and they attribute that to the possib
Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.
My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
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