Electronics Forum | Tue Jun 25 09:31:45 EDT 2002 | Myfloh
Hi everybody, Does someone have experience in the assesment of Surface Mount devices? For the moment we have the Must System II of Multicore but it is not effective to assess the solderability of Surface mount devices. Indeed the conditions are not
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh
I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing
Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Mon Nov 29 12:57:33 EST 2010 | cyber_wolf
We are looking at doing gauge R&R studies on our placement equipment. I know that IPC9850 cites the test vehicles and test parameters. One thing that we are not clear on is what gets used for an external measurement device. Any input would be greatl
Electronics Forum | Thu Jul 14 02:25:59 EDT 2016 | salini
Thanks Evtimav and davef... We are doing tar potting only over the moisture sensitive device (not all over the PCB) to make sure that it does not get effected by moisture. But am unable to test the reliability of the process. Continuous switching or
Electronics Forum | Sun Oct 20 12:49:11 EDT 2002 | johnw
Dave, I've had a few intersting conversations with Dr Lee, now there's a guy who know's stuff, but as it turn's out even he doesn't have all the answers on why things void. Many of his papers point towards oxides or contamination on the ball, so age
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
Electronics Forum | Tue Feb 26 17:00:15 EST 2008 | slthomas
I haven't had the luxury of machine based pth assembly in quite a while, but when I did, given that the machines control which parts are inserted (and to a lesser degree where they are inserted) we decided not to perform inspection on that part of th
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