Electronics Forum | Wed Jan 14 11:30:48 EST 1998 | Pierre Atchison
I am looking for equipment that can place and reflow c-tab devices. These devices are 0.012" pitch. Universal used to make a machine for this purpose, but it has been discontinued. If anyone has any info, please let me know. Thanks, Pierre Atchison p
Electronics Forum | Thu Jan 15 09:08:56 EST 1998 | Roger W Pufky
| I am looking for equipment that can place and reflow c-tab devices. | These devices are 0.012" pitch. Universal used to make a machine for this purpose, but it has been discontinued. | If anyone has any info, please let me know. | Thanks, | Pierre
Electronics Forum | Thu Jan 15 09:08:54 EST 1998 | Roger W Pufky
| I am looking for equipment that can place and reflow c-tab devices. | These devices are 0.012" pitch. Universal used to make a machine for this purpose, but it has been discontinued. | If anyone has any info, please let me know. | Thanks, | Pierre
Electronics Forum | Sun Dec 07 20:51:23 EST 1997 | john martin
part of my job is to id and source electronic components. i have an ongoing problem iding smt devices w/mfr codes in place of actual part numbers does a cross ref guide exist that will enable me to id a smt transistor(eg)by the marking codes on the d
Electronics Forum | Mon Feb 24 19:16:38 EST 2003 | Neil
Brad, This is a common problem and may relate to the design of the board. In all cases when a device such as a capacitor is place near the edge of the board and the board must be de-panelled, the capacitor must be parallel to the break line. If the
Electronics Forum | Mon Mar 10 16:29:09 EST 2003 | julief2000
Kevin, The Technical Devices Machine, the EVS is a stand alone system that can reclaim up to 75% of the dross weight as usable solder. It has a much more proven history than the Electrovert add on, as well as being lower priced. The Technical Devi
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Mon Oct 13 11:01:25 EDT 2003 | markhoch
Our customer is starting to see some solder joint failures during their extensive testing proceedures. Specifically with an SMD/DIP device that has a very small foot in relationship with the pad on the PCB. (By SMD/DIP device I mean a DIP IC that has
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet
All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p
Electronics Forum | Wed Jun 17 17:26:26 EDT 2009 | bandjwet
We are having to put an Intel Core 2 Duo Solo mobile processor in a 478-pin micro FCPGA package into a ZIFF socket. The devices currently only have lands (device rework) and we would like to attach the pins. Does anyone know the material compositio
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