Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Thu Mar 27 16:40:45 EDT 2008 | slthomas
(or just some static-safe foam tape) I need to seal a wire terminal block to a board for conformal coating purposes. Currently we glue it to a shim and glue the shim to the board (yuck), but I want to use die cut gaskets if I can make it cost effec
Electronics Forum | Sun Jan 24 20:11:45 EST 2010 | wmeliane
Hi I would like to get feedback on which of the following 2 machines to buy: -option 1: My100 with single Midas head -option 2: D1S with single P&P head I have experience with the Siemens D series. However I have no real experience with Mydata... Is
Electronics Forum | Wed Jan 27 11:22:51 EST 2010 | fredc
Hello TQS, We have made Micro Mechanics adapters for Mydata. The Micro Mechanics tips are used in die bonding machines. I have no doubt that an adapted nozzle would hold your die securely. From Grants posts in the past, he had problems with placement
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Wed Nov 08 14:28:39 EST 2000 | Finepitch Services
the current design must be a die-up one, so routing for a flip-chip on board will be a bit difficult. it almost HAS to be wire bonded, to me...
Electronics Forum | Thu Sep 14 11:42:10 EDT 2000 | chugarth
We are laying out a new circuit board for COB is there any place that has design critera, such distance from the die pads ti the circuit board lands.
