Electronics Forum: double and solder (Page 9 of 169)

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 13:13:49 EST 2005 | Mike

Hello, Some questions.... Are you running lead free? What alloy? What�s your pot temp at? Temp of the board after preheat? Are you getting any solder in the barrels (

No solder and solder bridge after Wave solder machine

Electronics Forum | Mon Nov 21 06:49:57 EST 2005 | pjc

Go to this link for a nice tool for wave solder process troubleshooting: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5 Look for "Wave Solder Troubleshooting Wizard" If you have an Electrovert machine, contact applica

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly

Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.

No solder and solder bridge after Wave solder machine

Electronics Forum | Fri Nov 18 08:31:09 EST 2005 | jdengler

This is way too long of a time. The SG probably changes significantly over this time. This could be a major contributor to your problems. Jerry

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ

No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly

Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy

With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT

Soldering robot and solder balls

Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart

Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212

but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire

Soldering robot and solder balls

Electronics Forum | Thu Jun 22 09:50:48 EDT 2017 | capse

Are you using nitrogen in your soldering process?


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