Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Tue Sep 22 11:20:08 EDT 1998 | S Maganti
We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along with
Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Fri Feb 23 15:14:51 EST 2007 | James
I have this board that we are currently having problems with. When we run the BGA side with the hotter temp. the connectors on the other side lift off their pads. The BGA is lead free, that is why we have to use the hotter profile. Would it be
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Mon May 08 08:54:28 EDT 2000 | Lee Radney
Ok... Anybody got any quick, low cost ideas that can help me here? We run various panel layouts (all products are same width) thru our reflow oven. The problem is that due to the different layouts of our panels, the moveable center support chain
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
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