Full Site - : essemtec ag clm9000 (Page 9 of 15)

What's happening at Essemtec AG in 2008?

Industry News | 2008-03-25 22:39:45.0

Comment from Martin Ziehbrunner, CEO

ESSEMTEC AG

New Inline Printer For Fine Pitch

Industry News | 2005-09-23 13:31:20.0

The SP200-AVC from ESSEMTEC is a new stencil printer for fully automatic SMT assembly lines. The unique trans-stencil vision system, the integrated stencil cleaner and the continuous squeegee pressure regulation provide highest precision and reliability. The printer is designed for quick setup and changeover.

ESSEMTEC AG

Essemtec Brazil’s Second Anniversary – Review, Balance and Future in One of the Leading Growing Markets Worldwide

Industry News | 2011-06-20 18:39:34.0

Two years ago, the Swiss company Essemtec AG entered the Brazilian market directly. By founding Essemtec Brazil in Sao Paulo, the Swiss family business invested in one of the worldwide leading future markets for electronics. Florian Schildein recently spoke with Patrick Greuter, Area Sales Manager of South America, and Roberto Cardozo, Managing Director Essemtec Brazil, about the development of the subsidiary and its prospects.

ESSEMTEC AG

Workshop: Three-Dimensional Arrangement of LEDs

Industry News | 2013-08-27 19:40:03.0

Due to technical progress with LEDs, ever more luminous semiconductors are coming onto the market.

ESSEMTEC AG

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Industry News | 2018-02-28 08:22:00.0

Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

Essemtec Receives 2019 Mexico Technology Award for Multi-function Component Placement

Industry News | 2019-10-24 16:14:40.0

Essemtec announces that it was awarded a 2019 Mexico Technology Award in the category of Component Placement – Multi-function for its FOX2. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

ESSEMTEC AG

Essemtec Won the 2021 Mexico Technology Innovation Award for Its Solder Paste Jet Dispensing Solution

Industry News | 2021-11-05 08:37:11.0

Essemtec received a 2021 GLOBAL Technology Award in the category of Mexico Technology Innovation Award for its Fox / Puma with Archerfish Solder Paste Jet Dispensing Solution. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

ESSEMTEC AG

Essemtec to Present Innovations at SMT Hybrid Packaging 2015

Industry News | 2015-03-10 11:09:24.0

Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.

ESSEMTEC AG

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Industry News | 2017-10-16 19:59:28.0

Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.

ESSEMTEC AG

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG


essemtec ag clm9000 searches for Companies, Equipment, Machines, Suppliers & Information