Electronics Forum: exposed copper (Page 9 of 13)

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol

Lead-free solder alloy: SN100C from AIM solder

Electronics Forum | Mon Jul 11 19:32:27 EDT 2005 | fctassembly

Yes, there have been many issues with the fast dissolution of copper by the SAC305 alloy. In fact, there are companies who have disqualified it for repair operations due to loss/thinning of the pads. SN100C dissolves copper much slower than SAC305 an

Unconventional way of making a PCB

Electronics Forum | Sat Dec 21 13:03:52 EST 2002 | V.RAMANAND KINI

Hi to all, All of us are familiar with the conventional way of making PCB...I mean...photo tools/expose/develop/etch/plate etc., These involve lots of chemicals and the work place is toxic. I have a small PCB with just two curves (circuit tracks)and

Porosity in Good Plating

Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone

If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F

| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal

| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered


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