Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Electronics Forum | Wed Sep 10 09:56:18 EDT 2003 | vickt
5 years ago (mostly likely 7-8 yrs). Most of these failures can be attributed to simple overtemp conditions or mechanical stress. Customers who do not keep the cooling fan filters clean on their machines tend to see a higher failure rate due to highe
Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Mon Oct 06 14:10:55 EDT 2008 | chineechooze
0.001969" You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? Are rated accuracies from placement equipment manufacturers typically "exgaggerated?" 2. On PCB Fab side of things, what is
Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111
We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After
Electronics Forum | Wed Sep 29 07:40:41 EDT 1999 | Wayne Bracy
| GUYS THANKS FOR THE INFO YOU SENT ME . NOW FOR MY | NEXT QUESTION. HOW DO I MARKET MY COMPANY? WHERE | DO I BEGIN TO LOOK FOR NEW CUSTOMERS WILLING TO TAKE | A CHANCE ON A NEW COMPANY WITH NO PROVEN TRACK RECORD? | WHAT ARE SOME OF THE QUESTIONS I
Electronics Forum | Wed Dec 21 17:11:47 EST 2005 | Mike Dolbow www.atotalgps.com
Has any one considered the melting eutectic of the plated part verses the eutectic of the paste it self. Inter metallic solids can form when mixing metals. Thus this causes solder joint reliability. Also a lot of vendors are putting out pure tin prod
Electronics Forum | Sun Mar 04 01:56:37 EST 2012 | eadthem
What we have had recently is a lot of larger thin (32 thou) thickness boards that have had issues with SC90 diodes bouncing off the pads in the final PNP machine. Our setup, universal instruments GC120 or quad beam 30 spindle lightning heads. This m
Electronics Forum | Thu Apr 05 09:17:40 EDT 2007 | itaig1
I have seen a method used where the pins on the connector are of the same materials as the thermocouple and the connector is connected via single strand wires of the same material to the PCB however the wires were spot welded to bare copper pads to r
Electronics Forum | Mon Jun 07 14:13:53 EDT 2004 | ricardof
Gabriele, yes you're right, but my question is more focused to restrictions as for the Operators, and then the performance in Screen Printer and Oven. The board has 400 high speed parts and 20 parts for Odd Shape machine (QFPs and 2 BGAs), Board is n
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