Electronics Forum | Mon Jan 29 17:25:10 EST 2007 | darby
I'm confused, How can your customer possibly EXPECT a fillet if the pad is smaller than the part? I thought everyone was over the whole toe fillet thing many years ago. Wasn't there some papers from NASA nearly ten years ago that advocated the "less
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill
Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson
I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where
Electronics Forum | Thu Jun 29 13:18:23 EDT 2000 | Gary
I was reading SMTs report on Lead Free solders and saw repeated references to Fillet Lifting as a failure mode. I have not found an explanation of what this is. Can anyone enlighten me? Thanks
Electronics Forum | Thu Mar 22 21:53:49 EST 2001 | davef
Don't mess with the doggie stuff until you get longer pads [and then you won't have to mess with it] because you'll just ruin your lead definition with more paste and still not have the heel fillet you desire.
Electronics Forum | Thu Mar 22 21:59:55 EST 2001 | dblsixes
ah ... but we had insufficient heel fillets in the old design toom when we had more pad area ... just not as bad
