Electronics Forum: flat (Page 9 of 80)

Re: OSP surface finish.

Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F

Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F

Re: BGA and PCB finishing

Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker

Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.

Re: Weebinjipped

Electronics Forum | Thu Jan 13 13:49:32 EST 2000 | Dave F

JAX: Thanks bud, I've been known to hurt myself walking across a flat floor. Hell, I hurt myself in bed one time, er wazat someone hurt me in bed on time??? Can't remember. Dave

Re: Via in the middle of a pad

Electronics Forum | Wed Jan 05 09:44:45 EST 2000 | Millerin Claude

Some PCB's manufacturers are now able to fill the hole and then re-metallized the pattern in order to obtain a final soldering surface perfectly flat but with an electrical connection under. This of course increase the price of the pcb but avoid any

smt on flexible board

Electronics Forum | Sun Dec 19 10:02:55 EST 1999 | ron chua

Hi, how to ensure flexible boards do not warp after reflow and still remain flat for subsequent operations. What is the best way to hold and transport these strips from one process to another. Thanks!

Re: CP4-2 XY Table

Electronics Forum | Fri Dec 03 08:06:23 EST 1999 | Mark Anderson

Firstly, Verify your Z-height per the procedure in the Maintenance manual. In general, release the placement stopper and rotate cam onto flat surface of board with z-axis at zero. There should be 0.15 mm compression of the spring

Fuji IPII BGA

Electronics Forum | Thu Oct 28 23:04:34 EDT 1999 | Micah Newcomb

Has anyone out there tried placing BGA's with a Fuji IP2? Fuji says flat out no way but I think we can if we get them in T&R.

Fuji IP3 Nozzles

Electronics Forum | Mon Sep 14 11:45:08 EDT 1998 | John McMasters

Has anyone used Fuji's rubber tip nozzles for the IP3? Are they O-ring type or suction cup? I'm having trouble picking up Ompacs due to the top of the part not consistently being flat. Any actual experience with these $1100 nozzles would be appreci

Soldering Method for Fine Pitch QFP's

Electronics Forum | Thu Feb 12 17:25:15 EST 1998 | Chuck Griffith

What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch

Re: Soldering Method for Fine Pitch QFP's

Electronics Forum | Fri Feb 27 14:27:54 EST 1998 | David Spilker

| What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch


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