Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi
I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi
Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F
Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Thu Jan 13 13:49:32 EST 2000 | Dave F
JAX: Thanks bud, I've been known to hurt myself walking across a flat floor. Hell, I hurt myself in bed one time, er wazat someone hurt me in bed on time??? Can't remember. Dave
Electronics Forum | Wed Jan 05 09:44:45 EST 2000 | Millerin Claude
Some PCB's manufacturers are now able to fill the hole and then re-metallized the pattern in order to obtain a final soldering surface perfectly flat but with an electrical connection under. This of course increase the price of the pcb but avoid any
Electronics Forum | Sun Dec 19 10:02:55 EST 1999 | ron chua
Hi, how to ensure flexible boards do not warp after reflow and still remain flat for subsequent operations. What is the best way to hold and transport these strips from one process to another. Thanks!
Electronics Forum | Fri Dec 03 08:06:23 EST 1999 | Mark Anderson
Firstly, Verify your Z-height per the procedure in the Maintenance manual. In general, release the placement stopper and rotate cam onto flat surface of board with z-axis at zero. There should be 0.15 mm compression of the spring
Electronics Forum | Thu Oct 28 23:04:34 EDT 1999 | Micah Newcomb
Has anyone out there tried placing BGA's with a Fuji IP2? Fuji says flat out no way but I think we can if we get them in T&R.
Electronics Forum | Mon Sep 14 11:45:08 EDT 1998 | John McMasters
Has anyone used Fuji's rubber tip nozzles for the IP3? Are they O-ring type or suction cup? I'm having trouble picking up Ompacs due to the top of the part not consistently being flat. Any actual experience with these $1100 nozzles would be appreci
Electronics Forum | Thu Feb 12 17:25:15 EST 1998 | Chuck Griffith
What is the proven industry solder attachment process for installing 240 lead (gull wing) quad flat packages with lead pitch
