Electronics Forum | Sun Jun 13 18:16:10 EDT 1999 | jgodfrey
I am looking into Alpha's system, and would appreciate some feedback from anybody using it currently. I am concerned about about the life expectancy of the foils if they are clamped and unclamped every couple of days, and what happens if one of the a
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
Electronics Forum | Tue Mar 16 03:16:18 EST 1999 | Scott Davies
| | Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probab
Electronics Forum | Thu Aug 16 19:56:38 EDT 2001 | davef
Awww, blank those fine tech support people at MPM. We know more than they do. Having said that, duh, umm er, please clarify the problem. * Are you concerned about paste squirting through the holes of the side 2 portion of the stencil when you are
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Thu Nov 14 12:11:00 EST 2002 | V.RAMANAND KINI
I am looking for a reflective coating on PCB. I have designed a PCB with SMT type side LEDs and Top LEDs. The light from these LEDs fall on to a lens profile on top of these and get mangnified and reaches the dashboard instrument's pointers. I tried
Electronics Forum | Tue Jul 22 09:05:14 EDT 2003 | davef
Any-Layer Interstitial [Inner] Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve
Electronics Forum | Sun Dec 12 13:29:40 EST 2004 | stuart
HI , We have been evaluating this remountable foil system with a view to replacing our existing one. We don't have space for framed stencils but production are complaining about the sharp foils. There's not much in the archives on it but it seems
Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton
If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.
Electronics Forum | Thu Feb 23 18:05:53 EST 2006 | kennyg
What are some general guidelines for the minimum proximity of apertures to a stepdown on a stepped stencil. I have a step from 7 mils to 5 (one mil step each on the top and bottom). How far does the step need to extend beyond the apertures on the
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