Electronics Forum | Tue Jun 26 19:48:29 EDT 2001 | davef
Information a SIR test vehicle can be found in IPC-9201, SIR Handbook [http://www.ipc.org]. Common test boards are: * IPC-B-24 (copper and HASL, FR-4 and polyimide) * IPC-B-36 (bare copper and HASL, FR-4 and polyimide) * IPC Phoenix board (bare copp
Electronics Forum | Tue Feb 01 10:49:39 EST 2000 | AF Ng
Could someone help to let me know which Standards ( IPC or others) which spell the number of thermal excursion that FR4 boards is allowed to exposed to ? Thank you
Electronics Forum | Thu Feb 03 10:22:23 EST 2000 | AF ng
Dear Dave, Thank you for your reply. What I meant thermal excursion is the solder cycle. That is for the same particular point, how many time we can solder them, for FR4 boards. Thank you
Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris
If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev
Electronics Forum | Tue Nov 16 18:02:29 EST 1999 | John Holland
What are the main advantages of moving from a 140 degree C FR4 laminate to a higher Tg laminate 180 degree C ?. Would the higher Tg laminate be less susceptable to bow and twist ?. John Holland
Electronics Forum | Tue Nov 16 11:02:46 EST 1999 | Dave F
Wolfgang: A snipet of information that maybe more on track that the previous babbling: The temperature limit for FR4 is 130�C according to UL746(?) Good luck Dave F
Electronics Forum | Thu Oct 07 22:05:23 EDT 1999 | Dreamsniper
Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard thanks and regards,
Electronics Forum | Wed Feb 24 16:15:50 EST 1999 | Justin Medernach
Fab Gurus, (Earl) What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. Thanks, Justin
Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc
Electronics Forum | Wed Feb 10 18:26:04 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
