Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Tue Jul 06 07:49:08 EDT 2004 | davef
Q1)What is the MSD level for PCB? A1) There is none Q2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assem
Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Wed Oct 16 08:38:12 EDT 2002 | caldon
OK Brian- I did my home work...Here are deep fried Twinkie links: http://baking.about.com/library/recipes/blmisc6.htm http://www.foxnews.com/story/0,2933,54280,00.html as on new paper put it..."boiled fat" Yummie. Thank goodness me being in Philadel
Electronics Forum | Thu Jul 24 12:20:17 EDT 2003 | pch_engineering
Excellent question. In theory there is no correct answer to this question. It sounds like smtgod has baked too many cookies in his reflow oven and is on a surgar high... I use about 10 different basic reflow profiles in my ovens. Everytime we run
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
