Electronics Forum | Fri Oct 02 09:22:24 EDT 2015 | derrikf
The following is representative of on-board temps of a FR4 at .069" thickness. The thermal couples were soldered directly to the board using high-temp solder. Again, the halogen-free solder requires an identical profile to our old solder. We had grea
Electronics Forum | Thu Sep 03 11:38:28 EDT 2009 | dyoungquist
I'd be more concerned with the pcb itself then I > would be with standard SMT components. Are you > using a PCB with a high Tg? (170 degrees C or > greater) The circuit board material is NP-170B (Nan Ya Plastics Corporation). It has a Tg of 170
Electronics Forum | Wed May 07 09:31:28 EDT 2003 | davef
We use uV Dymax glue for thermocouple attach sometimes, but don't like the remainder [anal] and loosing attach, sometimes. Roger Saunders, President Saunders Technology, Inc; said: PRO: � These products are easier to use than high temperature solde
Electronics Forum | Thu Nov 09 10:22:46 EST 2000 | John
Luckily for me, if the part were soldered and on the board prior to any processing, I will still be able to build it. I am currently experimenting with screen printing a high temp paste, hand inserting the part (even Chad hasn't come up with an econ
Electronics Forum | Fri Aug 29 09:39:08 EDT 2014 | rgduval
I'll try to deal with the issues as you've presented them. 1. Blistering/delamination, shown in photo 2. The most likely cause of blistering/delamination like this is moisture in the boards. The moisture can get into the boards in multiple ways..
Electronics Forum | Fri Oct 27 11:17:41 EDT 2006 | MFG CAVEMAN
Since I didn't see it mentioned - Are you specifying a laminate that is considered compatible with a RoHS process? I don't mean just a high Tg but a high Td (decomposition) and CTE material such as Isola 410, FR408 etc.
Electronics Forum | Wed Feb 24 16:47:30 EST 1999 | Earl Moon
| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Jus
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt
Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr
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