Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Tue Aug 09 10:46:43 EDT 2016 | emeto
this really depends on the pad sizes. You can see 15 different pad sizes for the same component package. Take a look in IPC 7525. I am attaching an article as well, so you can get an idea.
Electronics Forum | Thu Jun 24 11:54:36 EDT 2004 | rickw
many solder-ball issues can be resolved by reducing the aperture size, usually 10 to 15% reduction will work. If the aperture size is the same as the pad size paste tends to be squished out under the part, paste off pad under the part will liquify a
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Mon Aug 08 18:59:49 EDT 2016 | oleksz
What should be solder paste stencil aperture proper size in comparison with PCB copper pad for lead free technology? When designing PCB foortprints I was using solder paste pad undersize of 2.5 mils (0.06mm) per side (solder paste pad size was 2.5 m
Electronics Forum | Thu May 01 15:08:52 EDT 2003 | k_h
If Kapton tape doesn't work, I would recommend eating a few hundred bucks and ordering a new stencil. I think your asking for more trouble trying to plug the apertures with dried paste, glue, or anything else. It will dislodge sooner or later and pro
Electronics Forum | Mon Dec 11 17:09:27 EST 2000 | Michael Parker
Get a profiler for your oven. To say "we are not sure" and "we think it might..." shows you are running with a WAG (Wild Ass Guess). Not a good place to be if you intend to produce anything reliable, with quality. Run your profile and verify that yo
