Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug
| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f
Electronics Forum | Tue Nov 21 15:49:01 EST 2000 | CAL
Dave- this may not be much current help but for future needs: IPC-7525 Stencil Design Guidelines is due out real soon. Check with IPC on its status, last I heard it was in interim Final.What is nice about this Doccument is that it also covers Pin_Thr
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Sat Aug 28 14:23:52 EDT 1999 | JohnW
| Hi There, | | Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have
Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef
IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b
Electronics Forum | Fri Dec 08 11:30:19 EST 2006 | ganoi
We discussed about applying 2 dots of glue on either sides of the LED body, but have yet to try it out. Other discussions include conductive adhesive, using fixturing with weight, different stencil aperature design, hand soldering.
Electronics Forum | Wed Apr 04 08:28:27 EDT 2001 | Cal
ZAM_BRI- I don't know how effective this may be but some points to include in the buy-off procedure: Before submitting the PO for the stencil you may also want to do a CAD to Stencil comparison to verify correct apertures.There are SW packages and co
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Wed Dec 14 07:38:56 EST 2005 | tk380514
the original question was: Please give me some guidelines on designing Stencils for Fine Pitch. which i did however, 40% fallout for solder shorts this could be caused by many other processes having gone wrong before, i.e. type of solder paste
Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
