Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Wed Mar 11 10:55:07 EDT 2009 | gpost
I had contacted the dummy component suppliers but they didn't have anything that would work. We designed a simple daisy-chain PCB and die for SPC and training purposes, and purchased large quantities.
Electronics Forum | Tue Sep 05 05:25:27 EDT 2017 | heros_electronics
Hi, I think your friend wrongly changed the D code so that the finger width doesn't meet your requirements. And the fingers have long and short ones, which is hard to do selective gold plating because of not easy to add plating wires. Of course, you
Electronics Forum | Sat Oct 24 23:30:59 EDT 1998 | Pete Sorenson
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Thu Mar 05 21:31:35 EST 2009 | davef
Bill: We're pretty sure these guys don't offer the parts that you seek, but they maybe able to give you a lead. * Topline Dummy Components - http://www.topline.tv * Practical Components - http://www.practicalcomponents.com So, how about your equi
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Electronics Forum | Tue Apr 06 11:17:01 EDT 2004 | ccl
hi, i encounter gold surface contam issue on wire bonding ring after prebake at 150 C for 3 hrs, tis cause wire bonding non stick issue. the contam seem begin at the solder mask area toward center of the bonding ring, but is not consistance.
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
