Electronics Forum | Fri Nov 12 08:02:07 EST 2004 | no gel pig fan
I would get a demo set of the form flex (they will probably give you it for at least a few weeks hopefully a month) and check it out. They could be much more reliable than when I tested them. I would definately take a working form-flex over a working
Electronics Forum | Wed Jan 24 08:22:18 EST 2007 | cyber_wolf
Turning off the grid-lok is not an option. I have used the hand inserted tooling in the past..It takes too long to set up and it does not accomodate warped boards. So I am I safe in saying that there is not much I can do aside from change my board d
Electronics Forum | Fri Jan 26 14:48:38 EST 2007 | CL
I agree, There seems to be quite a bit of negative impression regarding Grid Lok. We have 4 DEK printers outfitted with them. We have had a few problems that were due to warped boards but other than that, they have worked well for us. Fixed tooling
Electronics Forum | Thu Feb 14 10:59:37 EST 2008 | stevezeva
Maybe what you could do is have the stencil contain a tightly spaced mesh or grid of openings over the ground plane areas that you need to be solder covered. Also, to help the solder flow out better, you might want to decrease the percentage of metal
Electronics Forum | Wed Jan 29 10:40:37 EST 2020 | tamasmagyar
Hi there, I used Grid-Lok and some other PCB support from Quik-Tool (don't ask me model :) ), which is pretty similar to Grid-Lok, in Viscom machines. We also had jigs for high volume products similar to those you would use for PCB routing, but with
Electronics Forum | Mon Feb 14 12:33:17 EST 2000 | Rob Douglass
Wondering what equipment is available to perform Single Site Screen Printing (e.g. Collumn Grid Array replacement. Any feedback regarding brands and approximate price would be greatly appreciated.
Electronics Forum | Mon Nov 20 13:18:38 EST 2000 | Steve Schrader
Is anyone populating boards with LGA's on a production basis? If so, what process issues should I be concerned with and what challenges do they present that would be different from BGA assembly? Thanks. Steve
Electronics Forum | Thu Aug 03 11:32:44 EDT 2000 | bzark
Any opinion on what size aperture and stencil thickness is most optimum for Land Grid Array 1.27mm pitch with .6mm pad using SN/AG NC solder paste?
Electronics Forum | Mon Jul 30 17:44:55 EDT 2001 | Carlton F.
You mentioned a few specific machines that this technology is working with now. Which have had the best results? Which have experienced problems and what were they? What changes are planned for the ones in current use if any? Thanks
Electronics Forum | Wed Oct 27 15:30:12 EDT 1999 | Aaron Unterborn
Phuc, One word of advice... Be sure to investigate your rework capabilities if you are going to use ceramic components. It gets tricky and expensive.