Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Tue Jan 05 07:48:39 EST 2021 | mbass
Go for Gen 2 NT feeders, the Gen 1 Feeders tend to be problematic the older they get whereas the Gen 2 feeders are a much better prospect. I've used 8, 12, 16, 24 and 44mm. Some problems to look out for is pull back of coverlay and removal of waste
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Tue Feb 24 15:52:58 EST 2015 | swiese242
We currently have around 20k+ components in stock. I would like to have some opinions on creating a more lean manufacturing system. We check stock in our system and then order parts. Most of time leading to employees looking for parts, or shorts. We
Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
Electronics Forum | Thu Jul 27 21:34:41 EDT 2000 | Dave F
Gary: That's curious. Tell us more about your process steps, temperature profiles, paste, warping of the board without the PIH processing, components, etc
Electronics Forum | Tue Apr 25 13:55:36 EDT 2000 | Rob Cass
Sequenced tape and reel I have talked with several companies, regarding sequence taping and reeling of axial components. However, non-are capable of SEQUENCING tape and reels for axial insertion. Please let me know of any companies that SEQUENCE.
Electronics Forum | Thu Oct 14 12:02:44 EDT 1999 | Larry Johnson
I was wanting to know if there was any type of formula that I could use to determine the correct packaging for a SMD For example, if I have the component measurements, can I find out what the correct width and pitch of the tape it comes in should be
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Mon Sep 17 10:11:26 EDT 2001 | jstarkweather
What is the tightest spacing that you have assembled 0201 components? Under what assembly scenarios did you produce the best/worst yield at this spacing?
