Electronics Forum | Fri Nov 16 08:33:46 EST 2007 | rgduval
For RoHS assemblies, we're spec'ing at least FR-406 for the higher Tg. We're currently requesting our customers to use ENIG finish, as we've had better luck with assembly in our process; but we're currently experimenting wtih lead-free HASL. As far
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Mon Sep 11 09:43:14 EDT 2006 | C.K.
So, your scenario is: * Lead Free Solder Paste * Lead Free Reflow Profile * RoHS Components * Non-RoHS (Sn-Pb HASL plated)PCB If that's the case, you should be just fine running your Lead-Free process. There is literature on the topic of lead
Electronics Forum | Tue Aug 29 16:17:07 EDT 2006 | cuculi54986@yahoo.com
Hey Board House, You forgot to mention Pb-free HASL, how come? I ask because where I work we're running Pb-free HASL as our "preferred" board finish.
Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine
Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Fri Jul 08 18:41:50 EDT 2005 | GS
2 micromillimeters have been "eaten" reducing so the amount of copper thikness. I know they are going to test also HASL by using SACX307. It will be good to know if some one already made HASL tests by using SN100C (N-Superior) Many Thanks GS
Electronics Forum | Fri Jul 08 10:13:15 EDT 2005 | fctassembly
Hi Jason, Did the SAC paste wet other board finishes adequately? I have seen no issues to date with solderability of SN100CL HASL boards with our No Clean pastes. Regards, Bob
Electronics Forum | Tue Aug 29 06:56:15 EDT 2006 | Loco
Just another thought, your leaded boards might have been HASL, which for soldering always flows just a little bit better then other finishes.
