Electronics Forum | Sat Dec 28 06:58:33 EST 2019 | kylehunter
> yeah...I never had airflow volume problems with > Hellers. When I had to build the system I was > referring to, we had an old Speedline oven, and > the way it was configured if you didn't provide > enough airflow to the outer ca
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Mon Apr 03 01:35:31 EDT 2006 | darby
I have a less than perfectly designed pcb requiring double sided lead free reflow. Several components from either side will detatch using the standard process. If I was using Sn63Pb37 I would just dispense some adhesive after paste and cure at the r
Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson
I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten
Electronics Forum | Tue Feb 17 13:47:33 EST 1998 | Chrys Shea
| I am currently evaluating some different reflow ovens | for a future purchase. The manufacturers we are | looking at are Conceptronic, BTU, and Heller. Any | feedback on these manufacturers would be welcome. | I am particularly interested in: | 1
Electronics Forum | Thu Dec 20 12:27:25 EST 2001 | seand
Hello Gentlemen, Dave has a good point. Proposing to move the rails for the sake of thermal integrity doesn't seem logical to address you issue. By adding a rail set you have simply added mass (almost like big heat sinks) throughout the oven vs. w
Electronics Forum | Mon Jan 14 15:15:25 EST 2002 | burb1999
Currently our company is in the process of putting together a SMT prototype line... I have experience with fuji, universal, DEK, MPM, BTU, Electrovet in a high volume application. Now with prototype builds we have narrowed down a few and would like
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Fri Dec 03 13:08:40 EST 2004 | Dreamsniper
The voids are between the interface of the pad and the solder joint of component chips. I have a good thermal profile and this problem occured only on certain product so since we have some common components, component termination contamination is no
Electronics Forum | Wed Jun 22 13:00:12 EDT 2005 | slthomas
"His opinion was that you could never achieve 500cfm, even with a jet engine attached, as the outlet on the oven was too small..." I had that experience with a washer that blew steam out of the entrance. He said we'd collapse the pipe before we ever
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