Electronics Forum: high temp masking tape (Page 9 of 13)

Re: Reflow Profiling

Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter

| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the

Re: Reflow oven for solder side components??

Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca

| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave

Re: unsoldered joints

Electronics Forum | Tue Sep 22 09:59:15 EDT 1998 | Mike C

| Hi Jacqueline! | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | If that is true, are there many vias concentrated

Re: Process Change

Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W

Re: Process Change

Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W

Re: Polyimide PCB card assembly

Electronics Forum | Wed Jun 02 09:50:00 EDT 1999 | Earl Moon

| Hello all | I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with

Re: Component Baking

Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon

| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a

Re: Too hot to handle

Electronics Forum | Thu Jan 28 10:09:51 EST 1999 | Charles Stringer

| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g

Re: Selective Wave Solder Palletizing

Electronics Forum | Mon Feb 08 17:11:04 EST 1999 | chris arnold

| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. Earl, Pallets can be extremely u

Re: 15G PQFP

Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach

I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad


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