Electronics Forum: immerse and tin (Page 9 of 38)

Immersion Au and ENIG surface finishes

Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef

They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm

Board with immersion Tin

Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick

Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr

So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 16:55:51 EDT 2021 | emeto

With Pb-Free HASL you can't use Pb process for sure as the melting point of tin is so much higher than the lead paste process. SAC305 is the most popular compound, unless your assembly requires something else for a specific reason.

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Suppplier of Immersion Tin plating solution in North America

Electronics Forum | Thu Aug 03 12:44:07 EDT 2017 | davef

Try: * RD Chemical [ http://rdchem.com/chemposit-sn-rd-51.html ] * MacDermid [ http://electronics.macdermidenthone.com/products-and-applications/printed-circuit-board/final-finishes/immersion-tin/ ] * Technic [ https://www.technic.com/applications

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef

Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen

Parylene Coating and BGA Reliability

Electronics Forum | Fri Oct 18 12:40:35 EDT 2013 | robertwillis

Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.

Soldering robot and solder balls

Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212

Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor


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