Electronics Forum: ion contamination machine problems (Page 9 of 14)

Homing Contact systems / versatec 3S. slow movement.

Electronics Forum | Wed Sep 04 10:10:10 EDT 2019 | jameshoward

I know exactly what your problem is as I have seen it many times. Your problem is with indexer 1 (the cylinder which runs up and down and actuates feeders on side 1). At each end of the travel of the indexer is a micro switch hidden down below the be

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi

| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: CSP Assembly- No-clean vs Aqueous

Electronics Forum | Wed Dec 30 17:34:23 EST 1998 | Michael Allen

I'm afraid we don't agree regarding the best test method to use here. My understanding is as follows. The omegameter test measures board-level, ionic contamination (i.e., average for the entire board area and all components); it does not tell you w

Re: Electronic manufacturing company near the beach.

Electronics Forum | Fri Sep 17 04:49:10 EDT 1999 | Brian

| | | Is feasible to have an electronic manufacturing company near the beach? How affect the corrosion the electronic components? | | | | | I guess it depends what you mean by 'near'. Will the building be a custom design or an existing one? What kin

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

SMT hand soldering on HASL or Ni-Au boards?

Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef

With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia

Re: Fiducials

Electronics Forum | Fri Feb 19 14:44:24 EST 1999 | Lance A. Smalley

You don't say what kind of machine you are using but several just use the edge of fiducials to determine area (and centers). If you are teaching in binary and have the ability to select a decision level (threshold), use a level half way between loss


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