Electronics Forum | Tue Jul 30 14:51:38 EDT 2013 | dyoungquist
How full is the barrel actually getting? Per IPC-A-610, 100% fill is the target but 75% fill is acceptable for Class 1, 2, and 3.
Electronics Forum | Tue Sep 06 12:41:52 EDT 2016 | kmclain
IPC J-STD-001 does not allow solder inspection to be combined with coating inspection for classes 2 and 3.
Electronics Forum | Fri Nov 17 11:03:32 EST 2017 | davef
IPC-A-610F, 10.1, Non-Soldered Contact Areas: Has words to the effect that for Class 1, 2, 3; it is defect to have solder or any other contamination in the critical contact area.
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris
IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h
Electronics Forum | Mon Nov 26 09:33:49 EST 2018 | charliedci
The problem you create by soldering from solder destination side (presuming you have already soldered from other side) is that you will trap air in PTH so you have virtually no continuous solder in PTH from one side to other. This will not meet IPC-A
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Thu Jul 20 16:33:13 EDT 2000 | Bill Brooks
Hi Bob, I am a member of the IPC Designer's Council and as the Education officer for our San Diego Chapter, I would like to see more information available to help educate the existing Designers and the students in design classes we are trying to ge
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