Electronics Forum | Tue Sep 26 10:04:52 EDT 2000 | Chris May
Darren, You may/will get people referring you to the archives, which is a fair shout. But, by "failure rate" you probably mean "acceptance". What is good and bad depends upon your own acceptance criteria (IPC-610 ?). Find out what the acceptance c
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre
I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th
Electronics Forum | Tue Mar 20 15:33:28 EST 2001 | CAL
Susan- My son would be very happy if you would guarantee his happy meal electronic toy for five years. As previously noted, "workmanship" is the key. CAL DRISCOLL CONTRACT MANUFACTURING, Inc. (if there were such a company) would build to IPC 610 or
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi
Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help
Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa
Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
