Electronics Forum | Thu Apr 07 14:05:53 EDT 2022 | SMTA-69080803
@cbart It's a mid-volume product and as I said, there are several boards (slightly different layouts) using the same component. When you say ISI, do you mean connectors? can you give me an example of what you used in the past?
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Wed May 09 10:39:03 EDT 2001 | davef
The two first level cuts at comparing placement machines are: * Placement rate * Range of component capabilities This boils-down approximately to machine price. Virtually, everyone's feeders are priced similarly. Go to "Circuits Assembly" magazine
Electronics Forum | Tue Jun 05 14:38:55 EDT 2001 | pteerink
You would be better served to check your print quality as you run. Any problems caused by dirty stencils ( plugged aps etc ) would show up right away as a defect. Search the forum for more on this subject. I seem to recall the same subject coming up
Electronics Forum | Tue Jun 05 20:45:54 EDT 2001 | davef
So, yer lookin' to detect a ~25um glob on the wall of the aperture on yer stencil, eh? Why not wash your stencils before you put them away? That's what we do. Give 'em a quick looksee, then rack 'em, if they're clean. Give 'em anudda looksee befo
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Fri May 31 16:26:22 EDT 2002 | Feederman
Steve, you might want to check out the pre-printed and print-on-demand label feeders that are available through Hover-Davis. These types of feeder remove the potential human placement errors which sometimes occur. The feeders are available for most p
