Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward
Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi
Electronics Forum | Tue Jul 13 06:49:53 EDT 2004 | imtiaz
In one board we are using 213 SMT components out of which 23 components are lead-free and the rest are leaded. The paste used is also leaded. Do we have to make any changes in the profile of our reflow oven ? Also will there be any negative effect on
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Mon Feb 12 17:05:29 EST 2007 | Jose
Today is more complicate to find components with lead than with "lead free", and the, I think that you have very feww lead components. And, if don�t work on exceptionals companies, you MUST use LEAD FREE PASTE. In one case, or in the opposite, the re
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Thu May 01 12:46:19 EDT 2008 | dphilbrick
Thanks for the link Samir. Although this thread does have some good info in it I don't think it is hitting the exact point I am trying to resolve. This seems to talk to a one profile fits all for running lead and lead free paste. I want to know about
Electronics Forum | Tue Feb 06 21:43:11 EST 2007 | Wayne
If it is instructed to ship lead free product to customer, then low temp lead free solder paste can be considered. For example, Viromet solder paste from Singapore Asahi (peak temp is between 220 to 225 degree C).
Electronics Forum | Thu Sep 01 02:51:31 EDT 2011 | zedor
HI, We currently have two SMT lines, one running leaded products and the other lead-free. There is a recommendation to combine the two to increase the line capacity. What do you think are the pros and cons, is there a risk in contamination ot the
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
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