Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Wed Apr 14 07:59:54 EDT 2004 | arcandspark
Makes a lot of sense, thanks for the excellent input. The peak temp I am running fo our pb free (238C and approx. 90 seconds above 183 C)is the recommended profile from T.I and also the solder paste manufacture. Not sure exactly what the melting temp
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Wed Mar 16 08:21:13 EST 2005 | leon
hi, what we have learnt is lead free parts are ok to use with lead solder except BGA where you have to be carefull at reflow.
Electronics Forum | Fri Feb 18 03:52:44 EST 2005 | abhirami
Lead Free Ball Grid Array packages are expected to be increasing the shipment numbers by 2006. How many guys out there are familiar with the lead fee BGA's and the associated processes? Can some one tell me who is the best and low cost supplier for t
Electronics Forum | Wed Apr 30 14:10:21 EDT 2008 | samir
Doug, yes sir there are some excellent stuff out there in the fine SMTNet archives. Here's one example: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9822&#Message39512
Electronics Forum | Thu May 01 21:47:12 EDT 2008 | dphilbrick
Took a couple of jumps to other threads but it was there http://www.mot.co.jp/about/ehs/green/ENV_PBFREEOV.pdf This document was exactly what I needed to send to my paranoid customer! Thanks again!
Electronics Forum | Tue Jun 26 15:36:57 EDT 2007 | bjrap3
The board thickness is 50 thousandths. The style of the BGA is a 324 ball BGA that has an isolated center region. The machine that I am using is the Air-Vac DRS25. I'm not too sure why the pads are being removed when I am desoldering. I know when
Electronics Forum | Thu May 01 14:25:31 EDT 2008 | ck_the_flip
Most white papers, like this one http://members.ipc.org/ipclogin/ipcmembers/IPC/Route/0706/0706techpaper.pdf, have written that lead contamination in a lead-free solder joint leads to all sorts of reliability problems. Consensus is that, if the cont
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