Electronics Forum | Wed Jul 17 10:22:15 EDT 2013 | rgduval
Sure. Section 7.4 covers unsupported holes, and defines the usual standards. Clinching, fillet on the plated side, lead protrusion, etc. Cheers, ..rob
Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Thu Oct 01 08:34:50 EDT 2009 | davef
First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond that, the temperature measured by thermocouples on your oven heaters are only loosely related the temperature of solder paste on your board. You need t
Electronics Forum | Sun Feb 06 07:49:16 EST 2000 | Dave F
Casimir: A comment and a couple questions: * Have you considered a machine that forms component leads to "self-clinch?" With this forming components snap into hole in the boards with the proper finished lead length and requires not trimming after
Electronics Forum | Mon Jun 05 18:50:10 EDT 2017 | caurbach
Hi Zac, My 2 cents: We had similar problems on a board in the same situation (tin-lead HASL, very long leads, low pot height, high pump RPM). Trimming the leads shorter, moving the pot closer to the board, and dropping the pump speed down to sane
Electronics Forum | Wed Nov 07 20:01:35 EST 2007 | davef
Josh: Hole size to lead diameter ratio is meaningless. Minimum and maximum component lead to finished hole size clearance do not vary according to component lead diameter or hole size. Regardless, here's what you want to smack those goofballs over i
Electronics Forum | Tue Aug 20 13:01:48 EDT 2013 | sevenzero
I read through this thread somewhat and checked out the pictures. I've programmed TH lead checks on a newer Yestech and an older Mirtec. I personally use the Yestech white-top/histogram check and the only solder inspection Mirtec has. In my experienc
Electronics Forum | Tue Feb 23 12:49:10 EST 2010 | gregp
Dilbert is correct. The CS-400E machine is the machine of choice. The component insertions are light guided, the components are automatically presented to the operator and the leads are automatically cut and clinched at programmable lead length and
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