Industry News | 2008-01-23 10:31:04.0
GREELEY, CO � January 21, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd, announce plans to exhibit SN100C� Lead-Free products in booth 128 at the upcoming Electronics West exhibition, scheduled to take place January 29-31, 2008 in Anaheim, Calif.
Industry News | 2008-09-12 01:24:36.0
GREELEY, CO � September 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 401 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Industry News | 2014-02-14 22:45:00.0
ASYS Group is proud to announce the all new SERIO 4000 Printer Platform from EKRA, as well as the revolutionary PULSE Mobile Line Assistant interface for ASYS Handling and Process machines.
Industry News | 2009-01-22 20:22:57.0
The DEK team is inviting visitors to this year's Southern Electronics Show to unlock the potential of their print process with a wide range of advanced technologies. Being held over 11th � 12th February 2009 at FIVE in Farnborough, UK, Southern Electronics will see the mass imaging leader showcase a wide range of Process Improvement Products and Productivity Tools designed to help customers 'expect more'.
Industry News | 2013-03-13 15:54:24.0
Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, congratulates its licensee FCT Assembly (www.fctassembly.com) on its 10-year milestone anniversary being celebrated this year.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Industry News | 2011-11-08 15:26:45.0
MYDATA will unveil new solutions at Productronica 2011 in Munich, Germany (November 15-18, Booth A3 340) that enable its customers to boost productivity by combining higher speed with flexibility in both NPI and volume production.
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Industry News | 2016-03-10 19:12:32.0
Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
