Electronics Forum | Mon Jul 13 13:48:37 EDT 2009 | christian01976
Hello! You can check your vacuum in MANUAL and then VACUUM IN MONITOR. You can switch the vacuum on or off for each head. With a TYPE 72 nozzle and no component the vacuum should be around 80 or 90 and with a component at the nozzle it should be ove
Electronics Forum | Tue Aug 24 05:11:32 EDT 1999 | George Verboven
| | Hello everyone, | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | |
Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies
Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected
Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis
| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots
Electronics Forum | Fri Jan 29 22:31:37 EST 1999 | Darren
| | | I am searching for application notes on the SOD-80. Also, I am looking for any problems that have been discovered while using it. Also, we are looking for the pick and place equipment upgrades that will be needed to use the package- Pricing,
Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T
| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad
Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
Electronics Forum | Fri Dec 08 18:37:01 EST 2000 | Dave F
Asymetry in heating or mechanical forces are the primary reasons for tombstoning regardless of the reflow method. [There's beaucoup of background in the fine SMTnet Archive on reflow tomstoning.] Your situation is curious, but at least you know why
Electronics Forum | Fri May 26 01:50:54 EDT 2000 | Craig
We have no experience in printing glue only in dispencing for short runs. We are finding that our gluing volumes are going up and want to look at screen printing as an option. We are placing 0805 and 1206 chips, melfs, sots and ics. What are the adva
