Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Wed Jun 03 07:59:16 EDT 1998 | Ying Yang
There are for you many issue and long is the road to digital happiness. UART well and modulate.
Electronics Forum | Sun Jun 09 21:10:11 EDT 2019 | don_julio
In our reflow oven it has pins which move at the predetermined speed to move the pcb through the various zones in the oven. The forward row of pins is fixed along the front of the oven. The rear set of pins is adjustable per the width of the pcb. We
Electronics Forum | Tue Feb 27 20:42:56 EST 2007 | pyramus
Hi anybody have experience with the Package on Package BGA components. I mean BGA over a BGA component assembly. Our R&D is requesting us feedback for the future usage of this part. Need to gather some info on possible SMT issues for usage of this B
Electronics Forum | Thu Aug 11 20:03:41 EDT 2022 | SMTA-69946521
I have a question about Humidity Indicator Cards (HIC) in sealed PCB packages. If a PCB package is temporarily opened where the HIC card indicates 20% humidity exposure and then the PCB package is resealed with a new HIC card. How is the 20% moisture
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Tue Aug 16 15:43:32 EDT 2022 | emeto
Humidity card should show actual humidity in the package accurately. If it shows below 10%, actual humidity should be less than 10%. There is nothing to account for from previous cards.
Electronics Forum | Tue Apr 10 00:01:33 EDT 2018 | kumarank
Hi All We are running Fuji NXTs SMT lines. For each line we have a individual client PC running on windows 7 which communicates with a main server which is also running on win7. Randomly we face issue like programs are not getting downloaded on the
Electronics Forum | Wed Feb 28 00:12:22 EST 2007 | Muhammad Haris
hi, Consider BGA1= bigger one BGA2= smaller one CONSIDERATION : 1. If bga2 is inside the bga1 then bga1 balls should not touch the bga2 upper surface i.e. the inside balls of bag1 package should b in ur mind, so choice is urs. METHOD: m
