Electronics Forum: mount devices (Page 9 of 24)

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

Re: Why do voltages fall in SMT?

Electronics Forum | Mon Sep 20 11:50:26 EDT 1999 | Wolfgang Busko

Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I won

Re: Standard pad sizes for reflow and wave

Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin

We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys? Gerry: I imagine there co

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

Couple of questions. 1) Are we talking alumina substrates as the ceramic material? 2) Are we co-firing gold as the conductors on the substrate surface? 3) In other words, is this a hybrid thick film circuit? 4) If so, how large or

Re: Selective Soldering wih Drag Machine

Electronics Forum | Fri May 22 10:43:23 EDT 1998 | Mike Konrad

You're right Earl� Drag soldering is a dead issue as far as new technology is concerned. They do, however, work for most through-hole boards� but so do wave machines. There are only two manufacturers left that still produce drag soldering machine

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages.

Re: castellations vs. no castellations

Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory

Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of

Re: SMD mounting height

Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange

We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components Robert, PPI

Re: SMD mounting height

Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange

We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components Robert, PPI


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